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September 2008

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Subject:
From:
Gary Bremer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gary Bremer <[log in to unmask]>
Date:
Tue, 2 Sep 2008 12:11:16 -0700
Content-Type:
text/plain
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text/plain (118 lines)
AR Conformal Coating is Acrylic Resin and has nothing to do with ESD protection.  The boards
 must be first placed in approved ESD bags prior to any other packaging material.

Gary Bremer

> Date: Tue, 2 Sep 2008 10:54:08 -0700
> From: [log in to unmask]
> Subject: Re: [TN] ANTISTATIC MATERIAL QUESTION
> To: [log in to unmask]
> 
> AR coating, what's that? Sounds like anti reflex coating....
> correct bubble wrap must have conductive stuff all through the plastic,
> if  I'm not wrong. There is seemingly less reliable stuff with just a 
> conductive
> spray coating, but it's forbidden here. MIL products demand safer bags and 
> bubble wrap.
> Inge
> 
> 
> ----- Original Message ----- 
> From: "McGee, Michael" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, September 02, 2008 9:39 AM
> Subject: Re: [TN] ANTISTATIC MATERIAL QUESTION
> 
> 
> When you open the bubble wrap, does it smell like solvent? If so, the
> marks are from under cured coating. We have seen a similar problem with
> AR coating in ESD bags. Added a 3 hr bake at 130F to eliminate the
> problem.
> The bake time/temp would depend on your process/coating/and coating
> thickness.
> 
> -Mike
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
> Sent: Tuesday, September 02, 2008 10:43 AM
> To: [log in to unmask]
> Subject: [TN] ANTISTATIC MATERIAL QUESTION
> 
> We have been noticing if bubble wrap is allowed to come in direct
> contact with a circuit card assembly (non ESD and ESD) sensitive that
> the bubble wrap leaves impression in the AR coating.  Do know if the
> resulting impression is related to uncured coating or reaction of the
> bubble wrap material?  Thanks for any information, Jon
> 
> 
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