Tan,

By building a finite element model of the assembly you are interested in 
and then carrying out the appropriate analysis on the model you can 
determine displacements, deflections and stresses in the assembly.

After that you can make an assessment of whether or not the assembly is 
going to survive. Of course the assessment is the hard bit...

Regards,



Tan Geok Ang wrote:
> We are evaluating different axis's and levels of G-vibration test with different temperatures.  
> Not CTE...
> What is E-module?
>
> ________________________________
>
> From: Hernefjord Ingemar [mailto:[log in to unmask]]
> Sent: Thu 8/14/2008 4:07 PM
> To: TechNet E-Mail Forum; Tan Geok Ang
> Subject: RE: Elasticity
>
>
>
> you mean CTE ?  Or E-module ? Why do you ask and what's the issue?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
> Sent: den 14 augusti 2008 03:11
> To: [log in to unmask]
> Subject: [TN] Elasticity
>
> Hi All,
>                 Can the elasticity of FR4 rigid PCB and solder joints (SnPb, SAC) be definite (with value)? Thanks in advance.
>
> Best Regards
> GA Tan
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
>   

-- 
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------