Hello David,
Please feel free to call me. (603) 557-7568 We would like to speak to you
too!
Deac
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: Tuesday, August 12, 2008 9:30 AM
To: [log in to unmask]
Subject: Re: [TN] Multilayer Flex-Rigid Fabricators capable of the following
Most likely we can help you with both assembly and rigid flex fabrication.
If you can send over some fab drawing we can DFM this portion ASAP.
Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-6571
F# 603-821-5723
M# 603-305-6250
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
Sent: Monday, August 11, 2008 3:55 PM
To: [log in to unmask]
Subject: [TN] Multilayer Flex-Rigid Fabricators capable of the following
Hi Technet
Apologies for asking what may not be a relevant or appropriate topic for
advice on, but here goes...
I am looking for a fabricators for industrial product volumes (100 per
month) of a troublesome PCB.
4 layer rigid + 2 layer flex + 4 layer rigid, 3 sections with 90 degree
folds. 10 layers total.
Because of large 0.8mm BGA's with > 500 balls I will be looking for:
#1 - 0.25mm(10mil) dia drills, 0.125mm(5mil) annulus on the inner rigid
layers, 0.225mm(9mil) drill wall to adjacent copper clearances on the inner
rigid layers, there will be no copper on the inner flex in these regions.
#2 - 0.1mm(4mil) track/gap on the inner rigid and 0.125mm(5mil) track/gap on
the outer rigid.
#3 - the flex is only for connections between the main sections and will be
in the form of a microstrip construction, 0.15mm
track/gap(6mil) 45ohm to 60ohm @ 1GHz.
#4 - flex distance board-board < 6mm(1/4inch) with <3mm(1/8inch) radius @
90degree, one time bend and mount.
#5 - Need full lead free assembly which will need to withstand at least
4 reflow passes @ 260C
#6 - Service life will be multiple 40C temperature cycles, in excess of 4000
cycles/annum.
#7 - Prefer not to have any acrylic adhesives or bondply, unless the is data
to support their suitability to the reflow processing.
#8 - UL certs would be a bonus, but could work around this.
#9 - Typical materials might be 370HR and Pyralux AP
It's a for cost constrained imaging/metrology system. To put it in
perspective, the component BOM cost for FPGA's, memories, DSP, 1.3Mpixel
image sensor and laser etc is ~$180 in 100 off quantities.
For that I am getting more than 20billion multiply adds per second and
2Gbyte of fast memory.
Best Regards
David Greig
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