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August 2008

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Subject:
From:
James Mahoney <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, James Mahoney <[log in to unmask]>
Date:
Tue, 12 Aug 2008 09:29:42 -0400
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text/plain
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text/plain (103 lines)
Most likely we can help you with both assembly and rigid flex fabrication.
If you can send over some fab drawing we can DFM this portion ASAP.

Thank you, 
Jim Mahoney 
Quick Turn Flex Circuits, LLC 
Applications Project Manager 
P# 603-821-6571 
F# 603-821-5723 
M# 603-305-6250 

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Greig
Sent: Monday, August 11, 2008 3:55 PM
To: [log in to unmask]
Subject: [TN] Multilayer Flex-Rigid Fabricators capable of the following

Hi Technet

Apologies for asking what may not be a relevant or appropriate topic for
advice on, but here goes...

I am looking for a fabricators for industrial product volumes (100 per

month) of a troublesome PCB.

4 layer rigid + 2 layer flex + 4 layer rigid, 3 sections with 90 degree
folds. 10 layers total.

Because of large 0.8mm BGA's with > 500 balls I will be looking for:

#1 - 0.25mm(10mil) dia drills, 0.125mm(5mil) annulus on the inner rigid
layers, 0.225mm(9mil) drill wall to adjacent copper
clearances on the inner rigid layers, there will be no copper on the inner
flex in these regions.

#2 - 0.1mm(4mil) track/gap on the inner rigid and 0.125mm(5mil) track/gap on
the outer rigid.

#3 - the flex is only for connections between the main sections and will be
in the form of a microstrip construction, 0.15mm
track/gap(6mil) 45ohm to 60ohm @ 1GHz.

#4 - flex distance board-board < 6mm(1/4inch) with <3mm(1/8inch) radius @
90degree, one time bend and mount.

#5 - Need full lead free assembly which will need to withstand at least

4 reflow passes @ 260C

#6 - Service life will be multiple 40C temperature cycles, in excess of 4000
cycles/annum.

#7 - Prefer not to have any acrylic adhesives or bondply, unless the is data
to support their suitability to the reflow
processing.

#8 - UL certs would be a bonus, but could work around this.

#9 - Typical materials might be 370HR and Pyralux AP

It's a for cost constrained imaging/metrology system. To put it in
perspective, the component BOM cost for FPGA's, memories,
DSP, 1.3Mpixel image sensor and laser etc is ~$180 in 100 off quantities.
For that I am getting more than 20billion multiply
adds per second and 2Gbyte of fast memory.

Best Regards

David Greig

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