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August 2008

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Subject:
From:
David Greig <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Greig <[log in to unmask]>
Date:
Mon, 11 Aug 2008 20:54:40 +0100
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Hi Technet

Apologies for asking what may not be a relevant or appropriate topic for advice on, but here goes...

I am looking for a fabricators for industrial product volumes (100 per

month) of a troublesome PCB.

4 layer rigid + 2 layer flex + 4 layer rigid, 3 sections with 90 degree folds. 10 layers total.

Because of large 0.8mm BGA's with > 500 balls I will be looking for:

#1 - 0.25mm(10mil) dia drills, 0.125mm(5mil) annulus on the inner rigid layers, 0.225mm(9mil) drill wall to adjacent copper
clearances on the inner rigid layers, there will be no copper on the inner flex in these regions.

#2 - 0.1mm(4mil) track/gap on the inner rigid and 0.125mm(5mil) track/gap on the outer rigid.

#3 - the flex is only for connections between the main sections and will be in the form of a microstrip construction, 0.15mm
track/gap(6mil) 45ohm to 60ohm @ 1GHz.

#4 - flex distance board-board < 6mm(1/4inch) with <3mm(1/8inch) radius @ 90degree, one time bend and mount.

#5 - Need full lead free assembly which will need to withstand at least

4 reflow passes @ 260C

#6 - Service life will be multiple 40C temperature cycles, in excess of 4000 cycles/annum.

#7 - Prefer not to have any acrylic adhesives or bondply, unless the is data to support their suitability to the reflow
processing.

#8 - UL certs would be a bonus, but could work around this.

#9 - Typical materials might be 370HR and Pyralux AP

It's a for cost constrained imaging/metrology system. To put it in perspective, the component BOM cost for FPGA's, memories,
DSP, 1.3Mpixel image sensor and laser etc is ~$180 in 100 off quantities. For that I am getting more than 20billion multiply
adds per second and 2Gbyte of fast memory.

Best Regards

David Greig

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