Talking wire bonding issues, which we can't avoid to 100%, I had many good chats with Carey Pico and Bruce Misner for years. What became of them, anyone?
example:
Inge
I've been wire bonding for 22 years(!!) to literally 100's of different products
and to everything including GaAs devices up to 96 GHz. Au Themocompression
(heat and pressure) wedge bonding is typically recommended for GaAs due to
brittle nature of material with concerns to ultrasonically induced cracks
and smaller loops for better Microwave performance with wedge bonding. It
is typically not related to EFO induced voltages in the device. With
countless Failure Analysis efforts I have never seen a confirmed failure of
EFO induced voltages but it is, of course, extremely difficult to confirm
and is rarely looked at.
By the way, you can very successfully bond GaAs with thermosonic (heat and
ultrasonic) ball bonding, however, efforts should be utilized to minimize
the amount of ultrasonics through higher temperatures and/or longer bond
times, especially with a 25 micron ball. Finally, Au Wedgebonding can be
reverse bonded with 1st bond on the substrate and 2nd bond on the device but
is usually easier to accomplish with 1st bond on the device, typically due
to targeting concerns (but that tail can be a pain at times). Forgive me,
You probably know most of this already but I included it for the benefit of
our friends in Technet.
Regards,
Bruce Misner
-----Original Message-----
From: Hernefjord Ingemar
Sent: den 11 augusti 2008 14:05
To: 'TechNet E-Mail Forum'; 'arnaud grivon'
Subject: RE: [TN] NiAu Specification for Al Wedge Wire Bonding
Arnaud et TNetters,
I've not found the wirebonding fishbone, it's so tiny that my cats may have eaten it all. How ever however, another fishbone may serve some of you, I'll send it to Dr Gregory , and well packaged so that the custom people don't feel the smell.
Ineg
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: den 15 mars 2007 14:51
To: [log in to unmask]
Subject: Re: [TN] NiAu Specification for Al Wedge Wire Bonding
Thanks for the cake, but coming back to the initial question, is there any standardisation or good practices for the NiAu plating used for Al wedge bonding?
Best regards,
A. Grivon
Hernefjord Ingemar a écrit :
> Arnoud,
>
> There is a lot to say, I send a good cake to start with ( 4Meg offline).
> If any further questions, send smoke signal. Trikeman is guru.
> Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
> Sent: den 14 mars 2007 16:01
> To: [log in to unmask]
> Subject: [TN] NiAu Specification for Al Wedge Wire Bonding
>
> Hello TechNet,
>
> A question for wire bonding gurus (and I know there are some).
> What are the NiAu specifications adapted for Al wedge wire bonding?
> Ni & Au thicknesses, electrolytic or electroless, roughness,
> hardness....
> Are there some normalized documents covering these aspects (IPC,
> MIL...)?
> Thanks in advance.
>
> Best regards,
>
> A. Grivon
>
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