Thanks both of you. Hmmm...so you mean that we need two machines, one for nano and one four micro scale. Never thought of that. We have a MARCH for the atomic layers, as you call it. Right. We got nada from them...except a note.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
Sent: den 11 augusti 2008 14:09
To: [log in to unmask]
Subject: Re: [TN] Plasma Surface Treatment For Conformal Coat
Steve,
Our plasma systems for cleaning before wire bonding, etc. do not have nearly the energy that the plasma de-smear / ashing systems have. While I am sure that both types of systems will be very similar in operation, one will just have to dial down on the horsepower when dealing with the wire bond cleaning system.
Bottom line being that if you can see the contaminate - our plasma systems won't get it off [there is just too much of it]. The de-smear/ashing systems will! We are only cleaning atomic layers of surface contaminates, generally.
March is out in California so they haven't even begun to think about waking up yet.
Low and Slow - Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, August 11, 2008 7:51 AM
To: [log in to unmask]
Subject: Re: [TN] Plasma Surface Treatment For Conformal Coat
Mornin' Inge!
Here's a book that looks pretty interesting. I haven't read it yet, only found it after you asked if there were any books out there.
I don't know anything about plasma cleaning, so it would be nice if there was something I could read to learn about it:
http://tinyurl.com/6g7n6c
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Monday, August 11, 2008 6:05 AM
To: [log in to unmask]
Subject: Re: [TN] Plasma Surface Treatment For Conformal Coat
Trikeman,
late reaction...I agree with Watt you say. One problem here: most of us know too little about running these machines. Do you know about any good books to place in the hands of our technischzans?
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
Sent: den 6 februari 2007 20:37
To: [log in to unmask]
Subject: Re: [TN] Plasma Surface Treatment For Conformal Coat
Joe,
From a microelectronics standpoint [hermetic type of stuff] I have always been under the impression that removal of silicone residue with standard gases such as Argon, Oxygen, Nitrogen, or Argon+Hydrogen mixes was not reasonably possible - talking RF plasmas in a partially evacuated chamber, here. Our best plan, was not to have it [silicone] there in the first place - silicones have a really nasty tendency to migrate all over the place, on occasion.
The greatest part of my fear of placing a silicone containing part within the chamber is that some of what gets dislodged from the piece in question may deposit on the chamber walls [instead of getting sucked out the vacuum]. This can mean that the next part to go into the chamber may get a smattering of this as it becomes knocked from the chamber walls. This would not be good for a part which was going to be wire bonded, for example.
At our power levels, angstoms, or atomic layers, of contaminates are removed. I don't normally attempt to remove visibly thick layers of contaminates with the plasma because doing so usually either takes a long, long, time and/or the parts become hot and/or discolored [eg O2 will turn silver black. Go long enough and SnPb solder will get dark and dull looking, etc.].
A 'quicky' O2 plasma - say 5 minutes, at 150W, at about 150-200 mT will do a nice job of activating the surface of many plastics for promotion of adhesive adhesion though. I have little doubt that it would also improve the wetting characteristics of your bare laminate and/or solder mask, but I would not necessarily lay claim that it would remove gobs of organics [within a reasonable time frame, that is].
I'm interested in hearing what Yoda Ingemar and D Hillman have to say on the matter.
PS - Ingemar, I had -16F, outside air temp this morning [-14F yesterday]. Getting more like your neck of the woods each day! Have had enough, thank-you.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E (US
SSA)
Sent: Tuesday, February 06, 2007 11:23 AM
To: [log in to unmask]
Subject: [TN] Plasma Surface Treatment For Conformal Coat
While we're on the subject of CC, does anybody use plasma to remove stubborn organic residues (e.g. silicones) from board surfaces, or otherwise change the surface energy to promote coating adhesion?
We're not talking about long or aggressive exposure here, just enough to remove a thin layer of contaminant, or roughen the surface of a glossy soldermask. So I'm not much concerned about removing markings or anything, but are there any other potential pitfalls?
Joe Kane
BAE Systems
Johnson City, NY
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