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August 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 7 Aug 2008 13:32:12 -0500
Content-Type:
text/plain
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text/plain (64 lines)
I posted a link to that article on this forum last week.
Thank you for writing that, Herr Engelmaier. It has been very helpful,
at least for me.
For those of you who missed it:
http://www.globalsmt.net/regions/japan/content/view/33/65/  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, August 07, 2008 1:12 PM
To: [log in to unmask]
Subject: Re: [TN] No-Flow Underfill CTE

Hi Ben,
Indeed you should be.
Work by Burnette and co-workers at Motorola has clealry shown that the
best combination of properties for the underfill are CTEs~26 ppm/C and
modulus of
5.5 GPa-further you want a snap-cure underfill not a slow curing one. 
I explained all of this in my reliability column in Global SMT &
Packaging magazine [Engelmaier, W., "Reliability Improvement with
Underfill," Global SMT &  Packaging, Vol. 6, No. 3, March 2006, pp.
66-67.]

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue,
Brittle Fracture, ENIG), September 22, Schaumburg Solder Joint
Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder Joint
Reliability: Part 4, Oct. 17, Timisoara, Rumania Solder Joint
Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



**************
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