As far as I can recall there is a difference of slightly longere time above liqudus, and surface tension , which produce better soldering results. However, without knowing the specific application requirement, any selection is shot in the dark.
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Aug 06 10:25:53 2008
Subject: Re: [TN] SOLDER FOR PCB REFLOW PRO CESS
Hi Ben,
Actually, it has never been proven that Sn62/Pb36/Ag2 prevents leaching on
components finished with silver—it appears to sound reasonable, but is an urban
myth.
Sn62/Pb36/Ag2 is somewhat stronger [which is totally without practical value—
and the still stronger SAC-solders cause pad cratering] than Sn63Pb and has a
slightly lower Solidus/Liquidus temperature. Creep-fatigue-wise there is no
significant difference.
Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia
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