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August 2008

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Sun, 31 Aug 2008 21:37:16 -0400
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----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Sun Aug 31 13:58:48 2008

Subject: Re: [TN] Question about heat transfer



Hi,





Thank you for your answers. Let me try to rephrase my question. What cooling

conditions will be more efficient, For example: if I want to reduce the PCB

temperature from 200º to 100º,

1. Air temperature is 40º and the flow is X.

or

2. Air temperature is 80º and the flow is 2X.

The flow is the amount of air flowing over the board during cooling zones.

(Not the slope….)



Thanks,

Eli.

2008/8/27, Eli Sarig <[log in to unmask]>:

>

> My question is related to the heat transfer at the cooling zones. I want to

> reduce the substrate temperature from 200º C to 100ºC; can you explain the

> relationship between the flowing air temperature and the flow rate? What

> is more important: the temperature of the air or the flow rate?

> Thanks,

> Eli.

>



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