"DVT program and demonstrated MTBF..."

You're assuming a lot.  <the stories I could tell> I'm going on the 
assumption they use one of the large EMS or ODM's. They're a big EMS 
so they must be smart and concerned about the quality the product 
with your name on it, no?  We can just hand it off and trust them, 
no? Now, now, don't laugh so hard. You could hurt yourself.

If it is one of large ESM's many of them don't even thermal shock or 
cross section pwbs for qual of product -- let alone section/thermal 
stress on an ongoing basis for lot acceptance.   And you want to talk 
about DVT? You expect them to think about solder joint reliability 
and do due diligence.  Don't even get started on ongoing reliability 
monitor...  :-)

Some days it great to be a QE.  You get to say "I told you so" to the 
genius MBA supply chain manager who got a promotion for a cost 
reduction by outsourcing and then eliminating your company "trust but 
verify" function.  Just don't say I told you so where anyone can hear 
you.  LOL!

dw


At 03:50 PM 8/27/2008, Guy Ramsey wrote:
>Yes, some are.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>Sent: Wednesday, August 27, 2008 2:29 PM
>To: [log in to unmask]
>Subject: Re: [TN] FYI Nvidia solder issues
>
>NO ONE is that stupid.............??????????
>
>Wonder what happened to their DVT program and demonstrated MTBF?????
>
>Going to cost them a LOT of cash for that issue with the laptops
>
>John Burke
>
>(408) 515 4992
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
>Sent: Wednesday, August 27, 2008 11:07 AM
>To: [log in to unmask]
>Subject: Re: [TN] FYI Nvidia solder issues
>
>I think it the reverse...
>
>Sounds like a couple of people thought high lead solders are good for
>burn-in PCAs... so it ought to work on chip interconnects..  Remember the
>Sn10/Pb90 @ 300C
>
>Paul
>
>Paul Edwards
>Surface Art Engineering
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>Sent: Wednesday, August 27, 2008 10:32 AM
>To: [log in to unmask]
>Subject: [TN] FYI Nvidia solder issues
>
>
>
>FYI: looks like it is a high lead related issue - probably in a move to
>comply with RoHS - by adding lead to the bumping process..?????
>
>
>
>Quote:
>
>
>
>"What supports the theory that a high-lead solder bump in fact is at fault
>is the fact that Nvidia ordered an immediate switch to use eutectic solders
>instead of high-lead versions in the last week of July. Eutectic solders are
>believed to solve the problem of fatigue cracking."
>
>
>
>Link is here:
>
>
>
>http://www.tomshardware.com/news/Nvidia-GPU-failure,6248.html
>
>
>
>
>
>Kind regards,
>
>
>
>John Burke
>
>
>
>
>
>
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