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August 2008

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Wed, 27 Aug 2008 11:28:45 -0700
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NO ONE is that stupid.............??????????

Wonder what happened to their DVT program and demonstrated MTBF?????

Going to cost them a LOT of cash for that issue with the laptops

John Burke

(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: Wednesday, August 27, 2008 11:07 AM
To: [log in to unmask]
Subject: Re: [TN] FYI Nvidia solder issues

I think it the reverse...

Sounds like a couple of people thought high lead solders are good for
burn-in PCAs... so it ought to work on chip interconnects..  Remember the
Sn10/Pb90 @ 300C 

Paul

Paul Edwards
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 27, 2008 10:32 AM
To: [log in to unmask]
Subject: [TN] FYI Nvidia solder issues



FYI: looks like it is a high lead related issue - probably in a move to
comply with RoHS - by adding lead to the bumping process..?????



Quote:



"What supports the theory that a high-lead solder bump in fact is at fault
is the fact that Nvidia ordered an immediate switch to use eutectic solders
instead of high-lead versions in the last week of July. Eutectic solders are
believed to solve the problem of fatigue cracking."



Link is here:



http://www.tomshardware.com/news/Nvidia-GPU-failure,6248.html





Kind regards,



John Burke






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