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August 2008

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 27 Aug 2008 10:09:44 -0400
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Bill, 

There has been some speculation that with the higher assembly temperatures of lead-free, that PCBs should have a Moisture Sensitivity Level - just like the components being mounted on them.? However, I don't think JEDEC will step up to the plate to adopt anything to do with PCBs.? So, it would be the job of the IPC to do that.? 

With the upcoming IPC meeting in late September, Schaumburg, Illionois, now would be a good time to debate the need for circuit board MSL levels. As pointed out, the group working on Storage and Handling will go a long way, but moisture absorbsion propensity is also a property of the resin/glass composition of the board.? 

How about it TechNetters?

Denny Fritz
MacDermid, Inc. 


-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Tue, 26 Aug 2008 7:19 pm
Subject: [TN] Moisture in PCB Assemblies



Fellow TechNetters:? I was asked a question by a valued customer if there is any 
other references made to moisture in raw PCBs and populated assemblies other 
than the J-STD-033 and also the IPC rework standards.? I've looked in IPC 
Standards I have on file however I could not find any references/guidlelines at 
all.? Can anyone out there shed some light on this???

I thank you folks in advance for your efforts on my behalf.

Bill Black
Medco
Q.A. Manager
Tel:? 631-667-9699

E-Mail:? [log in to unmask]

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