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August 2008

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 27 Aug 2008 10:08:51 -0400
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And of course, for more details on S, please see the specific thread that is on right now.

Ioan

-----Message d'origine-----
De : Bev Christian [mailto:[log in to unmask]] 
Envoyé : 27 août 2008 10:06
À : [log in to unmask]
Objet : Re: [TN] ENIG & BORON

Peter, 
I believe it never was a function of percent P, but always process control. High P was indeed found, but as a result of process control problems. And I believe sulfur content in the nickel bath was a big issue. I remember one IPC where one laminate maker could turn it on and off with the presence of a particular sulfur compound in the nickel bath. 
Bev 
RIM

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Aug 27 08:52:59 2008
Subject: Re: [TN] ENIG & BORON

"I know that too much Phosphorus (> 7%) can lead to "Black Pad". "

Actually, the occurance of Black Pad has become far less frequent since the 
introduction of Hi-P nickel baths, with about 9%-13% P.  It's now more a 
matter of process control than P content.

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