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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Wed, 27 Aug 2008 15:57:47 +0200
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text/plain (526 lines)
He may suphpher from perphectionism
Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: den 27 augusti 2008 14:00
To: [log in to unmask]
Subject: Re: [TN] NTC

This is priceless.  A Scot living in Cyprus, supports an American telling an Englishman that his English is wrong.  I am framing this one.

Doug Pauls




Brian Ellis <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/27/2008 06:11 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to Brian Ellis <[log in to unmask]>


To
[log in to unmask]
cc

Subject
Re: [TN] NTC






The International Union of Pure and Applied Chemistry decreed 'sulfur'
in 1990, as did the very British Royal Society of Chemistry Nomenclature Committee in 1992 and the Qualifications and Curriculum Authority for England and Wales recommended its use in 2000.

If the RSC say 'sulfur', that is good enough for me and I have used that orthography for at least a dozen years. The name comes from Latin, not Greek, so the 'ph' phoneme is etymologically incorrect. The Greek word for sulfur is 'θείον' which you can see bears no relation to the Latin/English words. Oxford (which accepts both spellings for all
meanings) gives the etymology as [Anglo-Norman sulf(e)re, Old French soufre from Latin sulfur, -phur, -pur, perh. rel. to the Germanic word repr. by Old English swef(e)l.] Sulfur is good enough for me!

Brian

Graham Naisbitt wrote:
> Brilliant.
>
> By the way chaps, the correct spelling is Sulphur. It uses a PH
> instead of an F!
>
> Graham Naisbitt - Dairy air, that's great.....
>
> On 26 Aug 2008, at 22:16, Whittaker, Dewey (EHCOE) wrote:
>
>> So that's where the term dairy-air came from.
>> Dewey
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>> Sent: Tuesday, August 26, 2008 2:04 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] NTC
>>
>> And Bev's analysis was so complete, he included the contribution from
>> the cattle herd flatulence that was grazing on Nortel grounds, it was
>> truly a astounding calculation.
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>>
>>
>>
>>
>> "Douglas O. Pauls" <[log in to unmask]> Sent by: TechNet
>> <[log in to unmask]>
>> 08/26/2008 03:58 PM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>> [log in to unmask]
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> Re: [TN] NTC
>>
>>
>>
>>
>>
>>
>> And what a trip that was.  Bev, you have to now tell the story of how
>> you calculated the Nortel contribution to global warming, so that
>> people understand why you are an authority on flatulence.
>>
>> Doug Pauls
>>
>>
>>
>>
>> Bev Christian <[log in to unmask]>
>> Sent by: TechNet <[log in to unmask]>
>> 08/26/2008 03:52 PM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Bev
>> Christian <[log in to unmask]>
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> Re: [TN] NTC
>>
>>
>>
>>
>>
>>
>> Paul,
>> Actually people expel hydrogen sulfide, not sulfur dioxide. I read it
in
>> a book about the subject written by a medical doctor. I regaled Doug
>> Pauls and Dave Hillman with hilarious trivia from the book as we
>> drove down highway one from SF to LA.
>>
>> At room temperature I would expect no reaction between methane and
>> silver. I am not so sure about possible reactions at elevated
>> temperatures. I am not a catalyst chemist.
>> Bev
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
>> Sent: Tuesday, August 26, 2008 3:02 PM
>> To: [log in to unmask]
>> Subject: [TN]
>>
>> Remembering the Guys from Myth Busters, key note speakers at IPC
>> LA...are those flatulent people who express sulfur dioxide in their
>> gaseous eruptions (from eating deviled eggs) belonging to the order
>> of the red flame or the order of the blue flame?
>>
>> I believe, that day in LA, that Bev enlightened us as to the major
>> component of the gases expressed by flatulent new born babies (H2).
>> How he would know such a thing was never explained however.
>>
>> Paul Reid
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
>> Sent: Tuesday, August 26, 2008 2:23 PM
>> To: [log in to unmask]
>> Subject: [TN]
>>
>> Well, I guess that depends on what the previous meal was.  I don't
>> know if methane has the same harmful effect on immersion silver as
>> sulfur. I suppose I could go knock back a dozen or so deviled eggs
>> and let you know......
>>
>> And Dewey, that was a horrid pun, even for you.  Well done.
>>
>> Doug Pauls
>>
>>
>>
>>
>> Inge <[log in to unmask]>
>> Sent by: TechNet <[log in to unmask]>
>> 08/26/2008 10:12 PM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Inge
>> <[log in to unmask]>
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> [TN]
>>
>>
>>
>>
>>
>>
>> So a TV living with a gaseous family is at risk?
>> Inge
>>
>>
>> ----- Original Message -----
>> From: "Woolley, Mark D. (Mark)" <[log in to unmask]>
>> To: <[log in to unmask]>
>> Sent: Tuesday, August 26, 2008 7:37 AM
>> Subject: [TN]
>>
>>
>> Any environment that contains sulfur, like hydrogen sulfide or sulfur
>> dioxide should preclude the use of IAg.  The sulfur will react with
>> the silver and "grow" sulfides which can be electrically conductive
>> resulting is shorts between vias.  This can occur even when the
>> concentrations are within OSHA limits for human exposure.
>> Silver sulfides can be semiconductors or conductors depending on the
>> chemical composition.  They are black in color instead of silver, any
>> exposed silver will be affected.
>>
>> Mark Woolley
>> Failure Analyst
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of James Verrette
>> Sent: Tuesday, August 26, 2008 8:25 AM
>> To: [log in to unmask]
>> Subject: [TN]
>>
>> What characteristics of the end use environment would cause IAg to
>> not be an appropriate finish and why?
>>
>> Jim Verrette
>> Senior Electrical Engineer
>>
>> ------------------------------
>>
>> Date: Mon, 25 Aug 2008 08:24:35 -0500
>>
>> From: "Stadem, Richard D." <[log in to unmask]>
>>
>> Subject: Re: ENIG White paper
>>
>> Dave,
>>
>> You write as if you are not at all familiar with IAg, which is
>> totally
>>
>> understandable. However, IAg has been around in full production mode
for
>>
>> many years now, and is rapidly becoming the most-used finish in the
>>
>> market. Do not confuse it with immersion tin finish, which has little
or
>>
>> no shelf life.
>>
>> IAg-finished circuit boards have a recommended shelf or storage life
>> of
>>
>> about 1 year. However, if packaged properly in a hermetically sealed
bag
>>
>> with silver saver paper liners, and stored away from sulfates, it is
>>
>> possible to use boards up to 5 years old or even longer with no
>> issues
>>
>> whatsoever. All you need to do is call out the packaging on the
>>
>> fabrication drawing per IPC 4553.
>>
>> I have soldered IAg boards that sat around exposed to the elements
>> for
>>
>> more than 4 years in previous lives, and they soldered up just fine,
>> no
>>
>> change in the DPMO.
>>
>> Some of the bare boards we use here at GD are 34" by 40", 48 layers,
>>
>> 1/2" thick, cost is about $48,000 each. Their finish is IAg. =20
>>
>> I have had a lot of experience with IAg over the past 10 years or so,
>>
>> having seen at least 150,000 IAg boards assembled and soldered with
>>
>> every type of component you can think of, and I have never
>> experienced
>>
>> any issues with them. I have experienced many, many issues with ENIG,
>>
>> however, and that is the finish that would keep me up at night
>> waiting
>>
>> for the bomb to go off. There are many reliability issues associated
>>
>> with ENIG such as black pad, brittle nickel, etc., etc, but just
>> think
>>
>> about the fact that you are soldering to nickel, which has a
dissolution
>>
>> rate about 50 times slower than copper.
>>
>> Should you ever have a solderability issue with IAg, you can have the
>>
>> fabricator rework the finish. If you have an issue with ENIG, the
>> only
>>
>> thing you can do is rework your scrap account.
>>
>> However, you need to take the end-use environment into consideration
>>
>> when you select a circuit board finish. ENIG (unfortunately) may be
your
>>
>> best choice. I would fully qualify just one assembly at a time, and I
>>
>> would fully qualify it. For Space use, I would not suggest IAg.
>>
>> -----Original Message-----
>>
>>
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