Mark
Try this as a starter if you don't have the part manufacturer
recommendations
http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf
Also this Intersil Tec Brief has good design guidelines
http://www.intersil.com/data/tb/TB389.pdf
Mickey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of kwood716
Sent: Tuesday, August 26, 2008 9:18 PM
To: [log in to unmask]
Subject: Re: [TN] LGA footprint
Mark,
Do you have a part number for this device? I'd be happy to take a look
at it for you.
Regards
Ken
_____________________________________
Kenneth J. Wood
President
Saturn PCB Design, Inc. * <mailto:[log in to unmask]>
[log in to unmask]
2737 Bishop Lane ( (407) 340-2668
Deltona, Fl 32725 fax: (386) 789-2765
www.saturnpcb.com
PCB_Design_new
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Larson
Sent: Tuesday, August 26, 2008 10:06 AM
To: [log in to unmask]
Subject: [TN] LGA footprint
Hi,
been lurking for a few months after not having posted for a couple
years. I
am wondering if anyone can give a rule of thumb for designing land
patterns
for an LGA, specifically for a 5mm square x 1.2mm high with rectangular
metalization pads ( MEMSic MMC302xM to be exact)
Shouldn't this be treated like any BGA, the pad size on the pcb the same
size as the metalization on the bottom of the part? LGA do not have
"solder
balls" like a BGA, so the rule of thumb making the pad 80% of ball size
does
not apply, and besides this part has .65mm x .35mm rectangular contact,
not
round.
thanks in advance
Mark
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