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August 2008

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Tue, 26 Aug 2008 19:57:22 -0400
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Bill,
Don Dupriest and Tom Kemp head up IPC D-35, Printed Board Storage and Handling Subcommittee. This committee is working on a doc that among other things will address your topic. However, it is not available yet, but we are getting closer. 
Bev
RIM

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Aug 26 19:19:20 2008
Subject: [TN] Moisture in PCB Assemblies

Fellow TechNetters:? I was asked a question by a valued customer if there is any other references made to moisture in raw PCBs and populated assemblies other than the J-STD-033 and also the IPC rework standards.? I've looked in IPC Standards I have on file however I could not find any references/guidlelines at all.? Can anyone out there shed some light on this???

I thank you folks in advance for your efforts on my behalf.

Bill Black
Medco
Q.A. Manager
Tel:? 631-667-9699

E-Mail:? [log in to unmask]

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