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August 2008

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Subject:
From:
kwood716 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, kwood716 <[log in to unmask]>
Date:
Tue, 26 Aug 2008 14:18:22 -0400
Content-Type:
text/plain
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text/plain (110 lines)
Mark,

Do you have a part number for this device? I'd be happy to take a look at it
for you.

Regards

Ken

 

_____________________________________
 Kenneth J. Wood
President
Saturn PCB Design, Inc.              *  <mailto:[log in to unmask]>
[log in to unmask]
2737 Bishop Lane                       ( (407) 340-2668
Deltona, Fl 32725                       fax: (386) 789-2765
www.saturnpcb.com

PCB_Design_new 

 

 

 

 

 

 

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mark Larson
Sent: Tuesday, August 26, 2008 10:06 AM
To: [log in to unmask]
Subject: [TN] LGA footprint

 

Hi, 

 

been lurking for a few months after not having posted for a couple years. I

am wondering if anyone can give a rule of thumb for designing land patterns

for an LGA, specifically for a 5mm square x 1.2mm high with rectangular

metalization pads ( MEMSic MMC302xM to be exact) 

 

Shouldn't this be treated like any BGA, the pad size on the pcb the same

size as the metalization on the bottom of the part? LGA do not have "solder

balls" like a BGA, so the rule of thumb making the pad 80% of ball size does

not apply, and besides this part has .65mm x .35mm rectangular contact, not

round.

 

thanks in advance

Mark

 

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