Hi, 

been lurking for a few months after not having posted for a couple years. I
am wondering if anyone can give a rule of thumb for designing land patterns
for an LGA, specifically for a 5mm square x 1.2mm high with rectangular
metalization pads ( MEMSic MMC302xM to be exact) 

Shouldn't this be treated like any BGA, the pad size on the pcb the same
size as the metalization on the bottom of the part? LGA do not have "solder
balls" like a BGA, so the rule of thumb making the pad 80% of ball size does
not apply, and besides this part has .65mm x .35mm rectangular contact, not
round.

thanks in advance
Mark

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