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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Tue, 26 Aug 2008 09:06:02 +0800
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text/plain (274 lines)
Do you encounter barrel fill up issue during PTH wave soldering process?
Though the profile and flux penetration were ok.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, 26 August 2008 5:23 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

I totally agree with George. Better to have to rework BGAs on IAg board
than on ENIG, for example.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Monday, August 25, 2008 2:15 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

We've been using ImAg as our surface finish of choice for Paul,

We've been using ImAg as our surface finish of choice for over 10 years.
We don't eliminate the Ag tarnish.  As long as there are pollutants in
the environment the Ag will only tarnish again.  Many of the products we
sell wind up in telecommunications equipment in areas with high levels
of air pollutants and the exposed Ag surfaces do tarnish but they have
not cause any reliability issues or problems when components on our
products have worn-out or failed.  Repair of failed components on ImAg
boards is no more difficult than repair on other surface finishes.  You
need to remember the ImAg on pads and features is not very thick and it
dissolves into the solder joint and you wind up soldering to copper.
Therefore, repair on an ImAg board is just like repair of there boards
where the soldering is to copper (e.g., OSP or HASL). 

Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer 40 Technology Drive, Warren,
NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell] [log in to unmask]
 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards
Sent: Monday, August 25, 2008 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

Richard,

How do you eliminate the Ag tarnishing on completed PCAs? 

Paul

Paul Edwards
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, August 25, 2008 6:25 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

Dave,
You write as if you are not at all familiar with IAg, which is totally
understandable. However, IAg has been around in full production mode for
many years now, and is rapidly becoming the most-used finish in the
market. Do not confuse it with immersion tin finish, which has little or
no shelf life.
IAg-finished circuit boards have a recommended shelf or storage life of
about 1 year. However, if packaged properly in a hermetically sealed bag
with silver saver paper liners, and stored away from sulfates, it is
possible to use boards up to 5 years old or even longer with no issues
whatsoever. All you need to do is call out the packaging on the
fabrication drawing per IPC 4553.
I have soldered IAg boards that sat around exposed to the elements for
more than 4 years in previous lives, and they soldered up just fine, no
change in the DPMO.
Some of the bare boards we use here at GD are 34" by 40", 48 layers,
1/2" thick, cost is about $48,000 each. Their finish is IAg.
I have had a lot of experience with IAg over the past 10 years or so,
having seen at least 150,000 IAg boards assembled and soldered with
every type of component you can think of, and I have never experienced
any issues with them. I have experienced many, many issues with ENIG,
however, and that is the finish that would keep me up at night waiting
for the bomb to go off. There are many reliability issues associated
with ENIG such as black pad, brittle nickel, etc., etc, but just think
about the fact that you are soldering to nickel, which has a dissolution
rate about 50 times slower than copper.
Should you ever have a solderability issue with IAg, you can have the
fabricator rework the finish. If you have an issue with ENIG, the only
thing you can do is rework your scrap account.
However, you need to take the end-use environment into consideration
when you select a circuit board finish. ENIG (unfortunately) may be your
best choice. I would fully qualify just one assembly at a time, and I
would fully qualify it. For Space use, I would not suggest IAg.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Thursday, August 21, 2008 3:22 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

Hi Werner,
Well, we seem to like to buy all the circuit boards for a production run
at one time which could be thousands and I worry about the special
handling. Some of the boards could end up being in stores for 9-12
months. We also have to do pretty comprehensive incoming inspection
which would keep me up at night wondering if the bare boards are being
handled (or not handled) correctly.. Setting of a time bomb of bad
boards.
Dave Connitt

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, August 21, 2008 3:10 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

Hi Dave,
Why ENIG? Have you considered imAg?

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue,
Brittle Fracture, ENIG), September 22, Schaumburg Solder Joint
Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder Joint
Reliability: Part 4, Oct. 17, Timisoara, Rumania Solder Joint
Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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