Trikeman,
thanks for digging in your X-files box. Except for the Taguchi-like
structure, I'll keep an eye on the +175 Centigrades. 50 degrees more than
was used for the opto chips. Why 38um wire and not 2um? Current? Is it
advantageous to use the thicker wire?
Not a rookie gutter answer either
----- Original Message -----
From: "Creswick, Steven" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 25, 2008 4:40 AM
Subject: Re: [TN] Wire bonding gurus ohoy!
Ingemar,
Continuing on with this thread, I went back to some of my records on InGaN,
SiC, GaAs, and the flurry of other LED-type acronyms and come up with the
following short list of qualified bond schedules for one bonder.
These schedules were 'Production Approved', based on DOE's, accelerated
aging, etc. etc. 1T = first bond time [ms], 1P = first bond power [the
machine generator's own special units], 1F = first bond force [gm].
My caveat is that no two machines are exactly identical, therefore a power
setting on one machine does not necessarily correlate to the same value on
another machine of the same model, etc. So, just because this works for me
on one F&K 6200, does not mean that the settings were the same on the next
6200 [although they tended to be close :-)]
Here they are:
1T 80±2 40±2 40±2 45±2 30±2 40±2
1P 39±4 55+5/-0 60+5/-0 80±3 75±3 80±2
1F 70±10 40±2 40±2 55±2 55±3 55±5
The above 6 first bond schedules represent a large cross-section of chip
manufactures and metallization types. All were done using the SPT
UTF-51IJ-CM-1/16-16mm 15MTA capillary. All with 38µm wire. The temps were
all 175±5°C. Devices plasma cleaned prior to bonding.
Specifically, the second and third parameter sets represent the difference
between the cathode and anode bond schedules on the same chip. Not much,
but enough to be visible over the long haul.
The first parameter set is highly unusual for me as I try to keep time below
[or well below] the basic power level. In this case time was very high and
power quite low. You will also note that the force was quite high for a
first bond too! It was an AlInGaP chip as I recall, but was unique to that
one chip... Almost like it strongly wanted a thermocompression bond ... I
guess you could say that I gave it a chilly TC bond.
All this does is provide a flavor of what worked for someone else, with
different chips, and different machines. I know that it is not a
cookie-cutter answer to your situation...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Monday, August 18, 2008 4:13 AM
To: [log in to unmask]
Subject: [TN] Wire bonding gurus ohoy!
Hi all,
will send a picture to Steve for getting help.
Thermosonic 25um gold balls don't stick to the thinfilm gold on a optic
chip.
2,500A Au over 400A Cr. Bad yield, many balls lift. No contaminations
found.
Despite I have the good fishbone, I can't find out why the odd pattern
under lifted bals.
A guess is that the capillary have to steep chamfer angle, so that the
U/S mechanical energy becomes concentrated in the middle. Anyone with
similar experience?
Inge
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