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August 2008

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Subject:
From:
Bob METCALF <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob METCALF <[log in to unmask]>
Date:
Fri, 22 Aug 2008 16:04:16 -0700
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I would also be very interested to see data that suggest ENIG properly 
processed by the fabricator is a potential time bomb. My experience has 
always been that ENIG that has had problems can be traced back to improper 
processing at the fabricator. 

Regards,

Bob Metcalf
Atotech Western Regional Manager

Cell 714-334-7667
E-Mail [log in to unmask] 

This e-mail and any attachments hereto are business documents of Atotech 
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Dave Connitt <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/21/2008 01:37 PM
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Subject
Re: [TN] ENIG White paper






Werner,
That's interesting.. Is there any data on that you could refer me to?
Dave Connitt 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, August 21, 2008 4:30 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG White paper

Hi Dave,
Based on my experience, ENIG is more of a (time)-bomb than imAg.


Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture, 
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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