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August 2008

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Subject:
From:
Chris Schaefer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Schaefer <[log in to unmask]>
Date:
Mon, 4 Aug 2008 18:15:53 -0500
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Hello all,

Just like many of you out there I am in the position of putting much labor into 
a non-value add process such as applying liquid mask to protect areas of a 
board from being soldered. I'm sure someone within these walls has come up 
with a good economical solution to this problem. This may be in the form of 
a 'cheap conveyorized robotic application system; an inline curing system; 
possibly a UV masking material to reduce cure time while still maintain cured 
integrity of the material; etc... The problem for us is that we need to apply 
masking as a bare board and after components are loaded. The bare board to 
protect locations from being soldered and the loaded board to hold down 
components during flow soldering. This very manual process is highly variable 
and comsumes much time, thus the reason to look for ways to improve this 
process. At the same time reduce labor and increase repeatability, it would be 
also very beneficial to reduce the amount of soils placed in our aqueous 
washers that would be perfect. Not asking for much.

Thanks in advance. Any help welcomed and appreciated.

Chris

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