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August 2008

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Thu, 21 Aug 2008 16:41:54 -0400
Content-Type:
text/plain
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text/plain (86 lines)
Regards,
George
George M. Wenger
Andr
Absolutely!



Regards,

George

George M. Wenger

Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]

[log in to unmask]

 

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Thursday, August 21, 2008 4:30 PM

To: [log in to unmask]

Subject: Re: [TN] ENIG White paper



Hi Dave, 

Based on my experience, ENIG is more of a (time)-bomb than imAg.





Werner

Future workshops:

Reliability Issues with Lead-Free Soldering Processes, September 22, 

Schaumburg

Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle

Fracture, 

ENIG), September 22, Schaumburg

Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia

Solder Joint Reliability: Part 4, Oct. 17, Timisoara, Rumania

Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia







**************

It's only a deal if it's where you want to go. Find your travel 

deal here.

      

(http://information.travel.aol.com/deals?ncid=aoltrv00050000000047)



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