The Task Groups and the work being done are in the IPC website. You can
review many of the drafts, and your input is welcome. Go to
http://www.ipc.org/Status.aspx or http://www.ipc.org/CommitteePage.aspx
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Zhao
Sent: Thursday, August 21, 2008 11:38 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill
I am curious to know how it will be addressed by the Task groups. As a
board fabricator, I have my two cents.
Blind vias will be flat and cap plated only if required by customer. In
that case, separate via fill step using Peters or PHP900 is taken prior
to final lamination. That is the best way to ensure a flat and platable
surface.
If not specified, blinds vias will be filled by resin during final
lamination, the surface will have a concave shape. And depends on
several factors, the %of fill varies. Then it comes to Electroless
copper or direct metallization. Electroless copper is very poor at
covering the resin surface, thus the separation or lack of coverage of
cap plating. Direct metallization does better jobs on bare resin spots
but not every shop has that process.
Regards,
Jason Zhao
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Thursday, August 21, 2008 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill
These issues are being worked and addressed in the Task groups. I know
you've had your fill of this, but it depends.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Thursday, August 21, 2008 8:32 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill
Does the 6012B mention anything about blind vias that have a plated cap?
When a blind via falls in an outerlayer ground plane area, it will be
plated over. I've seen some cross-sections that show separation between
that plated cap and the resin that filled the blind via hole. Is this
covered in 6012B?
Is this a defect?
thanks,
Eddie
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Grunde Gjertsen
Sent: Wednesday, August 20, 2008 11:23 PM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill
Hi
The copper thickness requirement is the same but there is a minimum fill
requirement for blind and buried vias. The plating requirements is
listed in 6012B table 3-2, the fill requirement is stated in 3.6.2.16,
beware that for space and military avionics the requirements are
tighter.
br
Grunde
Scott Westheimer <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>
19.08.2008 09:51
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to Scott
Westheimer <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Via hole fill
Can someone be so kind as to direct me to the IPC specification that
covers filled via's. I am looking for the min average copper plating
thickness required. These are non-conductive filled via's.
Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364
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