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August 2008

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Subject:
From:
Jason Zhao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Zhao <[log in to unmask]>
Date:
Thu, 21 Aug 2008 11:38:08 -0500
Content-Type:
text/plain
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text/plain (179 lines)
I am curious to know how it will be addressed by the Task groups. As a board
fabricator, I have my two cents.

Blind vias will be flat and cap plated only if required by customer. In that
case, separate via fill step using Peters or PHP900 is taken prior to final
lamination. That is the best way to ensure a flat and platable surface. 

If not specified, blinds vias will be filled by resin during final
lamination, the surface will have a concave shape. And depends on several
factors, the %of fill varies.  Then it comes to Electroless copper or direct
metallization. Electroless copper is very poor at covering the resin
surface, thus the separation or lack of coverage of cap plating. Direct
metallization does better jobs on bare resin spots but not every shop has
that process. 

Regards,
 
Jason Zhao


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Thursday, August 21, 2008 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill

These issues are being worked and addressed in the Task groups. I know
you've had your fill of this, but it depends.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Thursday, August 21, 2008 8:32 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill

Does the 6012B mention anything about blind vias that have a plated cap?
When a blind via falls in an outerlayer ground plane area, it will be
plated
over. I've seen some cross-sections that show separation between that
plated
cap and the resin that filled the blind via hole. Is this covered in
6012B?
Is this a defect?
thanks,
Eddie

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Grunde Gjertsen
Sent: Wednesday, August 20, 2008 11:23 PM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill


Hi

The copper thickness requirement is the same but there is a minimum fill
requirement for blind and buried vias. The plating requirements is
listed
in 6012B table 3-2, the fill requirement is stated in 3.6.2.16, beware
that for space and military avionics the requirements are tighter.

br
Grunde




Scott Westheimer <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
19.08.2008 09:51
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Scott Westheimer <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] Via hole fill






Can someone be so kind as to direct me to the IPC specification that
covers filled via's. I am looking for the min average copper plating
thickness required. These are non-conductive filled via's.

Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364
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