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August 2008

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Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eddie Rocha <[log in to unmask]>
Date:
Thu, 21 Aug 2008 08:32:05 -0700
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Does the 6012B mention anything about blind vias that have a plated cap?
When a blind via falls in an outerlayer ground plane area, it will be plated
over. I've seen some cross-sections that show separation between that plated
cap and the resin that filled the blind via hole. Is this covered in 6012B?
Is this a defect?
thanks,
Eddie

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Grunde Gjertsen
Sent: Wednesday, August 20, 2008 11:23 PM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill


Hi

The copper thickness requirement is the same but there is a minimum fill
requirement for blind and buried vias. The plating requirements is listed
in 6012B table 3-2, the fill requirement is stated in 3.6.2.16, beware
that for space and military avionics the requirements are tighter.

br
Grunde




Scott Westheimer <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
19.08.2008 09:51
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Scott Westheimer <[log in to unmask]>


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Subject
[TN] Via hole fill






Can someone be so kind as to direct me to the IPC specification that
covers filled via's. I am looking for the min average copper plating
thickness required. These are non-conductive filled via's.

Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364
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