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August 2008

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Subject:
From:
Grunde Gjertsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 21 Aug 2008 08:23:16 +0200
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Hi

The copper thickness requirement is the same but there is a minimum fill 
requirement for blind and buried vias. The plating requirements is listed 
in 6012B table 3-2, the fill requirement is stated in 3.6.2.16, beware 
that for space and military avionics the requirements are tighter.

br
Grunde




Scott Westheimer <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
19.08.2008 09:51
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Scott Westheimer <[log in to unmask]>


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Subject
[TN] Via hole fill






Can someone be so kind as to direct me to the IPC specification that 
covers filled via's. I am looking for the min average copper plating 
thickness required. These are non-conductive filled via's.
 
Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC 
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364 
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