Leif
The paste type is dependent on minimum size of aperture on stencil.
However, it is related to pitch of parts to make it more relevant for
users. I found this table from my paste manufacturer and believe that
there is similar one in IPC J-std-?? as well.
Usually, you need to have a minimum of 5-6 balls to fill width of an
aperture on stencil. The pad width of a typical 20 mil pitch QFP is 12
mils. The stencil aperture is typical 10 mils = 250 microns. Type 3
paste has max solder ball as 45 microns ( size range is 25-45 microns).
Thus, you will be having 5 to 10 balls to fill a aperture width of 20
mil pitch part. Hence, most commonly used paste for 20 mils parts is
Type 3.
Regards
Ashok Dhawan P.Eng.
Manufacturing Specialist
Parker Hannifin Corporation | Electronic Controls Division | 1305
Clarence Avenue | Winnipeg MB Canada | R3T 1T4
Phone 204.453.3339 ext. 390 | Fax 204.452.6776 | www.parker.com |
www.vansco.ca | [log in to unmask]
http://www.vansco.ca/disclaimer.php
-----Original Message-----
From: Leif Erik Laerum [mailto:[log in to unmask]]
Sent: Monday, August 04, 2008 8:23 AM
To: TechNet E-Mail Forum; Ashok Dhawan
Subject: Re: [TN] Solder Paste with craters.
Thank you Ashok. I have been looking for that. Where is this table
from?. You say pitch below. Is it really the pitch (as in the distance
between the pads) that dictates these guidelines you present or the size
of the pad/aperture?
Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com
Ashok Dhawan wrote:
> Leif
> I am currently using Tin Lead type 3 solder paste and have observed
> craters on large pads. I thought these to be globs of flux but could
> not find root cause. However, slowing down print speed seemed to help.
> Below is a guideline on selection of particle sizes:
>
>
> Powder Type Particle size Remarks
> 50 Type 2 53 - 10 um 25mils pitch
> 42 Type 3 45 - 25 um 20mils pitch
> 32 Type 4 36 - 25 um 16mils pitch
> 21 Type 5 25 - 15 um 12mils pitch
> 10 Type 6 15 - 5 um Wafer bumping
>
> Pl do publish your findings once your problem is resolved.
>
> Regards
> Ashok Dhawan P.Eng.
> Manufacturing Specialist
> Parker Hannifin Corporation | Electronic Controls Division | 1305
> Clarence Avenue | Winnipeg MB Canada | R3T 1T4 Phone 204.453.3339 ext.
> 390 | Fax 204.452.6776 | www.parker.com | www.vansco.ca |
> [log in to unmask] http://www.vansco.ca/disclaimer.php
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Leif Erik Laerum
> Sent: Thursday, July 31, 2008 5:09 PM
> To: [log in to unmask]
> Subject: Re: [TN] Solder Paste with craters.
>
> Richard,
>
> Based on the input and the comments I have received we will get a tube
> of T3 in house and try that. Your description makes a lot of sense to
> me. I am not sure what data the decision to use T5 was based on
> originally. The below can also explain the solder beading we see at
> times under large chip devices. Trying the T3 will be a very
> interesting experiment. Stay tuned.
>
> Is there a rule of thumb when it comes to when to use T3, T4 or T5
> with respect to aperture size?
>
> Leif Erik Laerum
> Quality Assurance Manager
> Texas Memory Systems
> [log in to unmask]
> Tel: (713) 266-3200 x468
> www.texmemsys.com
>
>
>
> Stadem, Richard D. wrote:
>
>> Hi, Leif
>> Thanks for your response earlier. It looks like you have a good
>> handle
>>
>
>
>> on the paste handling, etc.
>> I was going to ask why a type 5 paste was being used. I have a tough
>> time with a type 4, and generally speaking the industry uses a type
3.
>> With a type 5, you have an order of magnitude more fines, and they
>> are
>>
>
>
>> much smaller. Because this effectively raises the true metal content
>> above 94%, there is actually a little less flux, which I think is a
>> good thing.
>> But a type 5 is much tougher to control from a printing standpoint.
>> The fines, being smaller, separate more easily from the agglomeration
>> of the printed mass, and thus there are more issues with stray fines,
>> and with small solder balls spitting away in large flat areas, such
>> as
>>
>
>
>> under cap terminations and belly pads, etc.
>> So the first question is whether you need a type 5 in order to print
>> through some very small apertures, such as on flip chips, etc.
>> If not, try going to a type 4 or 3, and this may help with the stray
>> fines.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Leif Erik Laerum
>> Sent: Thursday, July 31, 2008 2:46 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Solder Paste with craters.
>>
>> Interesting feedback.
>>
>> The stencil is indeed 6 mil thick.
>>
>> The resistor pack pads are 22 x 10 mil and have 20 mil pitch. The
>> smallest BGA pads are 20 mil and have 30 mil pitch.
>>
>> Is it the case that type 5 has a higher flux percentage than the type
>>
> 3.
>
>> If so that could explain some of our findings.
>>
>> Leif Erik Laerum
>> Quality Assurance Manager
>> Texas Memory Systems
>> [log in to unmask]
>> Tel: (713) 266-3200 x468
>> www.texmemsys.com
>>
>>
>>
>> Guy Ramsey wrote:
>>
>>
>>> Smallest pads under mm BGA + 6 (60 mil??)laser cut stencil + type 5
>>> paste = me confused.
>>>
>>> This would be, in my opinion, a recipe for hot slump and solder
>>>
> fines.
>
>>>
>>>
>>
>>
>>> A design with components and features like you describe should be
>>> fine
>>>
>>>
>>
>>
>>> with type 3 paste. Let's talk about those capacitor and resistor
>>> networks. What is their pitch and land pattern dimension? Smaller
>>> than
>>>
>>>
>>
>>
>>> the BGA? A lot smaller? Okay maybe type 4 paste and a 4 or 5 mil
>>>
>>>
>> stencil.
>>
>>
>>> Guy
>>>
>>> -----Original Message-----
>>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Leif Erik Laerum
>>> Sent: Thursday, July 31, 2008 11:34 AM
>>> To: [log in to unmask]
>>> Subject: Re: [TN] Solder Paste with craters.
>>>
>>> Paul et al,
>>>
>>> The bubbles are more prevalent on the smallest apertures such as 1
>>> mm
>>>
>
>
>>> BGA pads and the resistor/capacitor pack pads.
>>> The temperature in the production area is between 68F and 75F.
>>> Humidity is relatively steady at 40%. (We are in Houston....)
>>>
>>> If anyone has any suggestions how to test the screens for
>>> cleanliness
>>>
>
>
>>> that would be great. That is a part of our process we do not
control.
>>> We have a stencil cleaner, but we can only visually see if they are
>>> really getting clean. We also bought some stencil cleaner for
>>> manually
>>>
>>>
>>
>>
>>> wiping down a screen, but it actually makes the screens "greasy". We
>>>
>>>
>> stopped using it.
>>
>>
>>> Ours stencils are the standard 60 mil laser cut. We do use a metal
>>>
>>>
>> squeegee.
>>
>>
>>> Leif Erik Laerum
>>> Quality Assurance Manager
>>> Texas Memory Systems
>>> [log in to unmask]
>>> Tel: (713) 266-3200 x468
>>> www.texmemsys.com
>>>
>>>
>>>
>>> Paul Edwards wrote:
>>>
>>>
>>>
>>>> Leif,
>>>>
>>>> I just have 2 questions...
>>>>
>>>> What size apertures do these bubbles occur on and is there a
>>>> particular aperture orientation in which they are prevalent?
>>>>
>>>> What is the humidity and temperature of the environment for the
>>>> paste
>>>>
>>>>
>>
>>
>>>> prior to putting it on the stencil>>
>>>>
>>>> Have seen something similar in certain kinds of SAC W/S pastes that
>>>> have been exposed to too much moisture and certain stencil cleaning
>>>> compounds...The saponifier was making soap bubbles when rolling in
>>>> the paste...
>>>>
>>>> Paul
>>>> Paul Edwards
>>>> Surface Art Engineering
>>>>
>>>>
>>>>
>>>>
>>>>
>>>>
>>>> -----Original Message-----
>>>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Leif Erik
>>>> Laerum
>>>> Sent: Wednesday, July 30, 2008 1:56 PM
>>>> To: [log in to unmask]
>>>> Subject: Re: [TN] Solder Paste with craters.
>>>>
>>>> Thank you everyone for contributing. Especially you, Richard.
>>>>
>>>> First of all these are NOT via in cap boards and we are using FR4.
>>>> Been there done that....
>>>>
>>>> Most of the items brought up by Richard we do have established
>>>> processes for. These are according to the recommendations of the
>>>> solder vendor, but if others feel differently, please chime in.
>>>> We log the solder used for each batch and the Date of Manufacture
>>>> for this. We typically do not accept a batch of solder that is
>>>> older
>>>>
>>>>
>>
>>
>>>> than 3 mts. This is so that we do not end up with too much out of
>>>> date solder at the end.
>>>>
>>>> - Solder is brought out of the fridge minimum 12 hours before use.
>>>> - We set a time limit that solder must can be stored out of the
>>>> fridge a maximum of 3 mts. Practically this ends up around 1 month
>>>>
>>>>
>> max.
>>
>>
>>>> - We do reuse solder that has been on the screen for up to two
>>>>
> weeks.
>
>>>> Then we throw it out.
>>>> - We never put solder back in the fridge.
>>>> - We are evaluating new suppliers of solder at the moment. We have
>>>> not audited the currents supplier, but that is a good idea. We
>>>> always
>>>>
>>>>
>>
>>
>>>> get the solder couriered locally and in a cool container so I do
>>>> not
>>>>
>
>
>>>> have any evidence that would lead me to put this on the solder
>>>> vendor, but.....
>>>> - As our process works boards sit no longer than 1 hour with
solder.
>>>> Usually much shorter than that.
>>>> - We are using Type 5 solder actually.
>>>> - All misprints go though the wash before it is reprinted.
>>>> - We use a DEK 248 that is not as automatic as I would like and
>>>> some
>>>>
>
>
>>>> of the issues we see are due to this repeatability problem, but
>>>> from
>>>>
>
>
>>>> the data I have gathered, this is not the cause of the solder fines
>>>> and craters.
>>>> - A Solder AOI would be nice. We do not have one of these (yet???)
>>>> - There could be an issue with too much solder. We are going to
>>>> reduce apertures some. There is some evidence of excessive solder.
>>>> - I am going to experiment with slowing down the print separation
>>>>
>>>>
>> speed.
>>
>>
>>>> Good point.
>>>>
>>>> Thx.
>>>>
>>>> Leif Erik Laerum
>>>> Quality Assurance Manager
>>>> Texas Memory Systems
>>>> [log in to unmask]
>>>> Tel: (713) 266-3200 x468
>>>> www.texmemsys.com <http://www.texmemsys.com>
>>>>
>>>>
>>>>
>>>> Inge wrote:
>>>>
>>>>
>>>>
>>>>> Hi Leif, you've just listened to His Master's Voice.
>>>>> You should take off your cap, when you speak to Richard Stadem.
>>>>> Impressive! I begin to feel that there are two exceptional stars
>>>>> at
>>>>>
>>>>>
>> TN.
>>
>>
>>>>> Steve...we already knew
>>>>> Richard...a supernova
>>>>>
>>>>> Inge
>>>>>
>>>>> Gah...my example was not very clever...a supernova is bright just
>>>>> for a short time...hmmm...a red giant then? hmmm...or a white
>>>>> dwarf...hm...none of them very striking....hmm....shining like
>>>>> Betelgeuse...hmm.....maybe Master Whittaker can give a hand?
>>>>>
>>>>>
>>>>> ----- Original Message ----- From: "Stadem, Richard D."
>>>>> <[log in to unmask]>
>>>>> To: <[log in to unmask]>
>>>>> Sent: Wednesday, July 30, 2008 6:53 AM
>>>>> Subject: Re: [TN] Solder Paste with craters.
>>>>>
>>>>>
>>>>> Hi, Leif
>>>>> Send your pictures to [log in to unmask]
>>>>>
>>>>> Can you tell me what solder paste it is you are using? How was it
>>>>> qualified for use?
>>>>>
>>>>> Here are just some of the questions you need to ask yourself in
>>>>> order to determine why you have an issue with solder fines:
>>>>> Do you have a good documented solder paste handling procedure? How
>>>>> is the paste handled, from vendor or distributor to your factory?
>>>>> When was the last time you stopped in at the distributor to verify
>>>>> their stock is being rotated and is kept refrigerated immediately
>>>>> upon receipt from the factory? How often do they turn the packages
>>>>> upside down to prevent flux separation? Are they a certified
>>>>> distributor who will pass on to you a lot recall notice from your
>>>>> solder paste vendor if there is a known bad lot?
>>>>> How long is the paste allowed to sit out on the stencil and how
>>>>> many
>>>>>
>>>>>
>>
>>
>>>>> times can a line of paste on the stencil be sheared (printed back
>>>>> and
>>>>> forth) before it is removed and replenished with fresh paste? Are
>>>>> the operators allowed to scrape up the unused paste on the stencil
>>>>> and re-deposit it into a jar for re-use later? Is the jar or tube
>>>>> of
>>>>>
>>>>>
>>
>>
>>>>> solder paste, once removed from refrigeration, allowed to set for
>>>>> two to four hours (depending on paste vendor and paste type) to
>>>>> reach room temperature prior to printing? Once removed from the
>>>>> refrigerator, is unused solder paste allowed to be put back in the
>>>>> refrigerator? Are you using Type 4 paste or Type 3? How good is
>>>>> the
>>>>>
>
>
>>>>> printer setup, ie, the repeatability of the registration of the
>>>>> stencil to the PWB? Are you performing some type of aperture
>>>>> reduction on all pads in general and at least a 50% reduction on
>>>>> large belly pads to prevent solder fines from being printed onto
>>>>> the
>>>>>
>>>>>
>>
>>
>>>>> board? If a board is misprinted, does the operator know better
>>>>> than
>>>>>
>
>
>>>>> to simply wipe off the board (embedding the paste into every space
>>>>> between the edges of the pads and the soldermask, into every small
>>>>> via, into every through hole, etc.) but is there a documented
>>>>> procedure detailing how the misprinted board is to be cleaned to
>>>>> prevent this? How is the solder paste packaged, jar or tube?
>>>>> (Tubes
>>>>>
>
>
>>>>> prevent a much larger volume of paste from being exposed to air
>>>>> and
>>>>>
>
>
>>>>> humidity, and also help prevent re-use of solder paste that has
>>>>> been
>>>>>
>>>>>
>>
>>
>>>>> out for awhile). Do you perform a good solder paste print
>>>>> inspection
>>>>>
>>>>>
>>
>>
>>>>> using a 3d AOI or some other type of automated inspection, and do
>>>>> you use the data from this inspection process to detect
>>>>> (real-time)
>>>>>
>>>>>
>>>>>
>>> paste defect trends and react to them with corrective actions?
>>>
>>>
>>>
>>>>> Sorry to ask so many questions, but all of these can contribute to
>>>>> fines, and there are many more factors that can cause them.
>>>>>
>>>>>
>>>>>
>>>>> -----Original Message-----
>>>>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Leif Erik
>>>>> Laerum
>>>>> Sent: Wednesday, July 30, 2008 8:29 AM
>>>>> To: [log in to unmask]
>>>>> Subject: [TN] Solder Paste with craters.
>>>>>
>>>>> Technetters,
>>>>>
>>>>> We are having an issue with solder fines on our lead free boards.
>>>>> We
>>>>>
>>>>>
>>
>>
>>>>> are using SAC305 WS and no nitrogen. I noticed that our boards
>>>>> have
>>>>>
>
>
>>>>> craters in the paste on the pads after being printed. Not all pads
>>>>> are deposited this way, but maybe 25%. These craters have an air
>>>>> bubble in them. The bubbles usually burst before the boards goes
>>>>> into the P&P, but the crater stays. The screening process is
>>>>> exactly
>>>>>
>>>>>
>>
>>
>>>>> the same for leaded and unleaded paste. The leaded paste does not
>>>>> behave this way. Could these craters be a symptom of the cause of
>>>>> the solder fines? Anyone have any experience with this?
>>>>>
>>>>> How do I go about posting pictures to stevezeva.homestead.com?.
>>>>>
>>>>>
>>>>> --
>>>>> Leif Erik Laerum
>>>>> Quality Assurance Manager
>>>>> Texas Memory Systems
>>>>> [log in to unmask]
>>>>> Tel: (713) 266-3200 x468
>>>>> www.texmemsys.com <http://www.texmemsys.com>
>>>>>
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>
>>>>> Please visit IPC web site
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