Grow your knowledge of key with IPC's new webcast series on Advanced Packaging!



When you register, we will send you a site license for the program. How you use it is up to you! Participate on your own from your office or from home - or reserve a conference room and invite colleagues to join you at no additional cost.   Register today by copy and pasting the following link into your web browser:

http://www.ipc.org/calendar/2008/AdvancedPackagingWebcastSeries0808/AdvandcedPackagin.htm



Register now and take advantage of these informative webcasts!



Assembly Process Guidelines for Wafer Level CSP August 21, 2008 - 10:00 am - 11:00 am



Today's consumers expect each new generation of personal entertainment and portable handset products to be smaller, thinner, lighter in weight ... and loaded with even greater functionality. How can electronics manufacturers offer a product that meets all those functional and performance expectations without increasing product cost? Many companies are turning to IC packages that are no greater than the die element.

A wide range of choices exist today for assembly of ultra-fine-pitch wafer level and die-size surface mount devices. Although solder remains the most common method for device attachment, a number of alternative methods - such as the use of conductive polymers and ultrasonic gold-to-gold interface - have been developed to reliably secure the miniature die-sized elements to the circuit structure.



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