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August 2008

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 19 Aug 2008 13:48:27 -0500
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I wouldn't. That is the last thing I would recommend. But it depends on
the use environment.
QFNs already have major issues with solder joint cracking due to CTE
mismatch. It is more likely you will have SJ reliability issues with
ENIG than with HASL or IAg.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: Tuesday, August 19, 2008 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum HASL thickness for SMT of QFN

Yes but I would recommend immersion gold when possible

Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-6571
F# 603-821-5723
M# 603-305-6250 

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Verrette
Sent: Tuesday, August 19, 2008 1:22 PM
To: [log in to unmask]
Subject: [TN] Maximum HASL thickness for SMT of QFN

What is the maximum SnPb HASL thickness/uniformity that can be tolerated
in the SMT assembly of a .5mm pitch QFN package?  Is there anyone else
out there putting .5mm pitch parts on HASL finished boards that is
willing to share their experiences?
 
Jim Verrette
Senior Electrical Engineer
 

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