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August 2008

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Subject:
From:
"McGlaughlin, Jeffrey A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, McGlaughlin, Jeffrey A
Date:
Tue, 19 Aug 2008 08:06:13 -0400
Content-Type:
text/plain
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text/plain (84 lines)
IPC-4761 is dedicated to vias 

http://portal.ipc.org/Purchase/CatalogSearchResults.aspx?Option=1&Produc
tTypeText=All&ProductTypeValue=All&Title=&Author=&ProductDesc=4761&Custo
m1=&Custom2=&Custom3=&Custom4=All&Demographics=pa_wpromote%24%7c

Jeffrey A McGlaughlin, CID
Engineering Designer
Battelle
505 King Ave
Columbus Ohio 43201-2693
Phone (614)424-7582



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Smith, Rick
Sent: Tuesday, August 19, 2008 7:47 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole fill

I think you can find this in IPC-2226

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Westheimer
Sent: Monday, August 18, 2008 1:46 PM
To: [log in to unmask]
Subject: [TN] Via hole fill

Can someone be so kind as to direct me to the IPC specification that
covers filled via's. I am looking for the min average copper plating
thickness required. These are non-conductive filled via's.

Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364
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