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August 2008

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Subject:
Re: Via hole fill
From:
"Smith, Rick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Smith, Rick
Date:
Tue, 19 Aug 2008 07:46:33 -0400
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text/plain
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text/plain (34 lines) 
I think you can find this in IPC-2226

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Westheimer
Sent: Monday, August 18, 2008 1:46 PM
To: [log in to unmask]
Subject: [TN] Via hole fill

Can someone be so kind as to direct me to the IPC specification that covers filled via's. I am looking for the min average copper plating thickness required. These are non-conductive filled via's.

Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC [log in to unmask]: (919)713-0748Cell NC: (919)961-5364
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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