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Date: | Wed, 27 Aug 2008 11:07:27 -0700 |
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I think it the reverse...
Sounds like a couple of people thought high lead solders are good for burn-in PCAs... so it ought to work on chip interconnects.. Remember the Sn10/Pb90 @ 300C
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 27, 2008 10:32 AM
To: [log in to unmask]
Subject: [TN] FYI Nvidia solder issues
FYI: looks like it is a high lead related issue - probably in a move to
comply with RoHS - by adding lead to the bumping process..?????
Quote:
"What supports the theory that a high-lead solder bump in fact is at fault
is the fact that Nvidia ordered an immediate switch to use eutectic solders
instead of high-lead versions in the last week of July. Eutectic solders are
believed to solve the problem of fatigue cracking."
Link is here:
http://www.tomshardware.com/news/Nvidia-GPU-failure,6248.html
Kind regards,
John Burke
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