Brilliant.

By the way chaps, the correct spelling is Sulphur. It uses a PH  
instead of an F!

Graham Naisbitt - Dairy air, that's great.....

On 26 Aug 2008, at 22:16, Whittaker, Dewey (EHCOE) wrote:

> So that's where the term dairy-air came from.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Tuesday, August 26, 2008 2:04 PM
> To: [log in to unmask]
> Subject: Re: [TN] NTC
>
> And Bev's analysis was so complete, he included the contribution from
> the
> cattle herd flatulence that was grazing on Nortel grounds, it was  
> truly
> a
> astounding calculation.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> "Douglas O. Pauls" <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/26/2008 03:58 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> [log in to unmask]
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> Re: [TN] NTC
>
>
>
>
>
>
> And what a trip that was.  Bev, you have to now tell the story of how
> you
> calculated the Nortel contribution to global warming, so that people
> understand why you are an authority on flatulence.
>
> Doug Pauls
>
>
>
>
> Bev Christian <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/26/2008 03:52 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Bev Christian <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> Re: [TN] NTC
>
>
>
>
>
>
> Paul,
> Actually people expel hydrogen sulfide, not sulfur dioxide. I read  
> it in
> a book about the subject written by a medical doctor. I regaled Doug
> Pauls and Dave Hillman with hilarious trivia from the book as we drove
> down highway one from SF to LA.
>
> At room temperature I would expect no reaction between methane and
> silver. I am not so sure about possible reactions at elevated
> temperatures. I am not a catalyst chemist.
> Bev
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
> Sent: Tuesday, August 26, 2008 3:02 PM
> To: [log in to unmask]
> Subject: [TN]
>
> Remembering the Guys from Myth Busters, key note speakers at IPC
> LA...are those flatulent people who express sulfur dioxide in their
> gaseous eruptions (from eating deviled eggs) belonging to the order of
> the red flame or the order of the blue flame?
>
> I believe, that day in LA, that Bev enlightened us as to the major
> component of the gases expressed by flatulent new born babies (H2).  
> How
> he would know such a thing was never explained however.
>
> Paul Reid
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
> Sent: Tuesday, August 26, 2008 2:23 PM
> To: [log in to unmask]
> Subject: [TN]
>
> Well, I guess that depends on what the previous meal was.  I don't  
> know
> if methane has the same harmful effect on immersion silver as  
> sulfur.  I
> suppose I could go knock back a dozen or so deviled eggs and let you
> know......
>
> And Dewey, that was a horrid pun, even for you.  Well done.
>
> Doug Pauls
>
>
>
>
> Inge <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/26/2008 10:12 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Inge
> <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN]
>
>
>
>
>
>
> So a TV living with a gaseous family is at risk?
> Inge
>
>
> ----- Original Message -----
> From: "Woolley, Mark D. (Mark)" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, August 26, 2008 7:37 AM
> Subject: [TN]
>
>
> Any environment that contains sulfur, like hydrogen sulfide or sulfur
> dioxide should preclude the use of IAg.  The sulfur will react with  
> the
> silver and "grow" sulfides which can be electrically conductive
> resulting is shorts between vias.  This can occur even when the
> concentrations are within OSHA limits for human exposure.
> Silver sulfides can be semiconductors or conductors depending on the
> chemical composition.  They are black in color instead of silver, any
> exposed silver will be affected.
>
> Mark Woolley
> Failure Analyst
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of James Verrette
> Sent: Tuesday, August 26, 2008 8:25 AM
> To: [log in to unmask]
> Subject: [TN]
>
> What characteristics of the end use environment would cause IAg to not
> be an appropriate finish and why?
>
> Jim Verrette
> Senior Electrical Engineer
>
> ------------------------------
>
> Date: Mon, 25 Aug 2008 08:24:35 -0500
>
> From: "Stadem, Richard D." <[log in to unmask]>
>
> Subject: Re: ENIG White paper
>
> Dave,
>
> You write as if you are not at all familiar with IAg, which is totally
>
> understandable. However, IAg has been around in full production mode  
> for
>
> many years now, and is rapidly becoming the most-used finish in the
>
> market. Do not confuse it with immersion tin finish, which has  
> little or
>
> no shelf life.
>
> IAg-finished circuit boards have a recommended shelf or storage life  
> of
>
> about 1 year. However, if packaged properly in a hermetically sealed  
> bag
>
> with silver saver paper liners, and stored away from sulfates, it is
>
> possible to use boards up to 5 years old or even longer with no issues
>
> whatsoever. All you need to do is call out the packaging on the
>
> fabrication drawing per IPC 4553.
>
> I have soldered IAg boards that sat around exposed to the elements for
>
> more than 4 years in previous lives, and they soldered up just fine,  
> no
>
> change in the DPMO.
>
> Some of the bare boards we use here at GD are 34" by 40", 48 layers,
>
> 1/2" thick, cost is about $48,000 each. Their finish is IAg. =20
>
> I have had a lot of experience with IAg over the past 10 years or so,
>
> having seen at least 150,000 IAg boards assembled and soldered with
>
> every type of component you can think of, and I have never experienced
>
> any issues with them. I have experienced many, many issues with ENIG,
>
> however, and that is the finish that would keep me up at night waiting
>
> for the bomb to go off. There are many reliability issues associated
>
> with ENIG such as black pad, brittle nickel, etc., etc, but just think
>
> about the fact that you are soldering to nickel, which has a  
> dissolution
>
> rate about 50 times slower than copper.
>
> Should you ever have a solderability issue with IAg, you can have the
>
> fabricator rework the finish. If you have an issue with ENIG, the only
>
> thing you can do is rework your scrap account.
>
> However, you need to take the end-use environment into consideration
>
> when you select a circuit board finish. ENIG (unfortunately) may be  
> your
>
> best choice. I would fully qualify just one assembly at a time, and I
>
> would fully qualify it. For Space use, I would not suggest IAg.
>
> -----Original Message-----
>
>
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