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Mon, 4 Aug 2008 19:49:47 -0400 |
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Something called localzed reflow might help?
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Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Mon Aug 04 19:15:53 2008
Subject: [TN] Liquid Masking Deposition Process
Hello all,
Just like many of you out there I am in the position of putting much labor into
a non-value add process such as applying liquid mask to protect areas of a
board from being soldered. I'm sure someone within these walls has come up
with a good economical solution to this problem. This may be in the form of
a 'cheap conveyorized robotic application system; an inline curing system;
possibly a UV masking material to reduce cure time while still maintain cured
integrity of the material; etc... The problem for us is that we need to apply
masking as a bare board and after components are loaded. The bare board to
protect locations from being soldered and the loaded board to hold down
components during flow soldering. This very manual process is highly variable
and comsumes much time, thus the reason to look for ways to improve this
process. At the same time reduce labor and increase repeatability, it would be
also very beneficial to reduce the amount of soils placed in our aqueous
washers that would be perfect. Not asking for much.
Thanks in advance. Any help welcomed and appreciated.
Chris
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