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Sender:	DesignerCouncil <[log in to unmask]>
X-To:	Designers Council Forum <[log in to unmask]>, Mark Larson <[log in to unmask]>
Date:	Tue, 26 Aug 2008 08:02:33 -0700
Reply-To:	"(Designers Council Forum)" <[log in to unmask]>, Denis Lefebvre <[log in to unmask]>
Subject:	Re: LGA land pattern
From:	Denis Lefebvre <[log in to unmask]>
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In-Reply-To:	A<[log in to unmask]>
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I believe the IPC-7351 landpattern viewer, provided by PCB Matrix can
give you the answer.

Denis Lefebvre, CID+
Sr. PCB Designer
Finisar Corporation
(408)542-3832

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Mark
Larson
Sent: Tuesday, August 26, 2008 7:18 AM
To: [log in to unmask]
Subject: [DC] LGA land pattern

Hi,
does anybody have experience with designing footprints for a rectangular
pad on an LGA? the LGA is 5mm sq with 8 .35mm  .65mm rectagular
metalization on bottom. for those not familiar, an LGA is a BGA without
the solder ball, hence, cannot simply reduce pad size 80% of ball size

the specific LGA is a MEMSic MMC3002xM

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