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July 2008

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Subject:
From:
Bob Willis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Willis <[log in to unmask]>
Date:
Wed, 2 Jul 2008 11:23:44 +0100
Content-Type:
text/plain
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text/plain (129 lines)
For those not familiar smart-e-link forum is similar to the IPC groups and
using the same software so you can search the archives for the forum at 
http://lists.smartgroup.org/scripts/wa-SMARTGROUP.exe?A0=SMART-E-LINK 

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
 
www.ASKbobwillis.com
 
New Bob Willis "Printed Board Inspection & Quality Control Workshop" 3rd
September www.ASKbobwillis.com/PCBworkshop.pdf 
 
Book your place on Bob's "Step by Step Failure Analysis Workshop" 11th
September  www.ASKbobwillis.com/faworkshops.pdf
 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: 02 July 2008 10:39
To: [log in to unmask]
Subject: Re: [TN] Silver-Palladium termination SMT solder problems

There has been a similar thread on smart-e-link in the last week.
The general consensus was that AgPd terminations are not compatible with
SAC.
Rex


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Grant Emandien
Sent: 02 July 2008 10:20
To: [log in to unmask]
Subject: [TN] Silver-Palladium termination SMT solder problems

Hi all,
 
We are experiencing poor solderability with AgPd-terminations on MOVs
exposed to a lead-free reflow profile using a SAC alloy on an
ENIG-finished PCB. Though we have run this board only once previously
with the same part finish using a lead-rich alloy, we had similar
effects but not to the extent we are now experiencing.
 
Can anyone provide some insight into this/
 
Regards
Grant
 

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