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July 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 23 Jul 2008 11:52:27 -0500
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Huh? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Zhao
Sent: Wednesday, July 23, 2008 10:58 AM
To: [log in to unmask]
Subject: Re: [TN] looking for ENiG photos

What are the evidences that the boards could be electrolytic
Nickel/Immersion gold?  I doubt that combination is any good as etch
resist.
I would cross section some traces. If the nickel/gold covers the
sidewall of the traces, then it should be ENIG. If the nickel/gold only
covers the top of the traces with some overhanging, then your guess
could be at least half correct. Unless they have some magical way to put
full body electrolytic nickel plating after etch. 

Regards,
 
Jason Zhao


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete Houwen
Sent: Wednesday, July 23, 2008 10:20 AM
To: [log in to unmask]
Subject: Re: [TN] looking for ENiG photos

I may have found the answer - 

Could this be an electrolytic Nickel/Immersion gold? The board uses 8
mil minimum conductor patterns?

I also just found out they took our Shanghai engineer to a differenet
plant for the site inspection, and that the cross section and
solderability testing on one of the boards was done on a non-RoHS board
with Sn/Pb solder, who knows what they actually sent us.

Is this some odd universe I've been transported to?  Does anyone else
have to deal with such runaround?

Pete

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