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Subject:	Re: They solder well... But they don't work!
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Tue, 22 Jul 2008 09:12:53 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (42 lines)

Hi Dale,
In all your descriptions, you are not telling us what the failure mode 
actually is. On the basis of what do 75% not pass? Are the failures just some 
undefined functional dysfuction?—your wire-bond inclusion in the discussion leads me 
to believe this.
You also are not telling us what the reflow profiles [both standard and 
increased] at the QFP leads [not the PCB soldering pads] are. This is needed to 
make sure that the heat sink, which the die is and to which the leads are 
attached, does not keep the lead temperature too low even with your increased 
profile.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg, Germany
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Parts 1 & 4, Oct. 17, Timisoara, Rumania
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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