Grow your knowledge of key with IPC's new webcast series on Advanced Packaging!
The IPC Webcast Series "Advanced Packaging" is a convenient, affordable way to gain a solid overview of essential topics. Each webcast is a targeted, one-hour session you can "attend" right from your office - which means there are no travel expenses, and no unnecessary downtime. Plus, each session features a presentation by a respected industry expert, followed by a question-and-answer period.
When you register, we will send you a site license for the program. How you use it is up to you! Participate on your own from your office or from home - or reserve a conference room and invite colleagues to join you at no additional cost. Register today by copy and pasting the following link into your web browser:
Register now and take advantage of these informative webcasts!
Selecting Components for Lead-Free SMT Assembly
August 14, 2008 - 10:00 am - 11:00 am
Is your company able to accommodate lead-free soldering ... and effectively work with lead-free compatible components? With the European Union's Restriction of Hazardous Substances (RoHS) directive firmly in place, you need to be able to answer "yes." Even if legislation doesn't require you to comply, sweeping change throughout the global marketplace does. Now that component manufacturers worldwide have abandoned lead-containing alloy terminal plating, every assembly company needs to modify its process to accommodate lead-free components.
About the webcast:
This informative, one-hour webcast explores the impact of lead-free components, reviews several component manufacturers' specifications, and examines various compatible laminates and surface finishes for circuit boards.
Assembly Process Guidelines for Wafer Level CSP
August 21, 2008 - 10:00 am - 11:00 am
Today's consumers expect each new generation of personal entertainment and portable handset products to be smaller, thinner, lighter in weight ... and loaded with even greater functionality. How can electronics manufacturers offer a product that meets all those functional and performance expectations without increasing product cost? Many companies are turning to IC packages that are no greater than the die element.
A wide range of choices exist today for assembly of ultra-fine-pitch wafer level and die-size surface mount devices. Although solder remains the most common method for device attachment, a number of alternative methods - such as the use of conductive polymers and ultrasonic gold-to-gold interface - have been developed to reliably secure the miniature die-sized elements to the circuit structure.
About the webcast:
In this one-hour webcast, participants will get a solid overview of current wafer level and die-size package technologies, plus explore common assembly process options, attachment material variations and manufacturing methodologies detailed in the new IPC-7094 document, Design and Assembly Process Implementation for Flip Chip and Die Size Components.
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