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July 2008

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Mon, 7 Jul 2008 08:21:24 -0400
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text/plain (98 lines)
Lee,
Welcome back!

When you look at the "pits" in cross-section using an SEM, do they look
black?  Sounds like classic case of Black Pad.  Small pads connected to
larger pads (a ground plane is a really, really big pad in comparison)
are more prone to this.  And, yes, it gets worse with the amount of time
in the bath.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Monday, July 07, 2008 8:07 AM
To: [log in to unmask]
Subject: [TN] ENIG PLATING QUALITY

Now that I am back in the collective (resistance is futile), I got a
question...

We got several ENIG plated boards whose Ni layer has some "pitting" or
corrosion in the PTH's with ground planes only. This has resulted in
poor solder joints in a Class 3 environment (SnPb solder so far). The
SMT pads and PTH's without ground planes do not have this "pitting" or
corrosion phenomena. 

Our immediate thought was that there was too much P in the process, but
analysis shows the P levels were minimum.

A couple of questions...

1. The board house indicated that the boards were in the plating baths
too long. Any comments on this?

2. Received samples that have this same "pitting" or corrosion phenomena
but to a much lesser extent that produced good solder joints. We've put
them through vibration testing and they passed so far. Any comments on
the long term solder joint reliability?

3. What are the high reliability standards for ENIG plating porosity
quality (i.e. "pitting" or corrosion)?

Thanks.

Lee Whiteman
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 
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