We find we cannot run immersion tin twice through reflow at RoHS
temperatures. First side is always fine - second side - never works.
Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: July-04-08 5:35 AM
To: [log in to unmask]
Subject: [TN] Immersion Tin Problem

We do not usually use Immersion Tin finish boards but we have some with
a problem.
The boards are about 10-12 weeks old, stored in original packing, double
sided PTH and lead free processed.
Side 1 processed OK
Side 2 had some non-wet problems (Profiles and dwells etc are industry
'norm')
Hand soldering has proved to be nigh on impossible.
The immersion tin is within the thickness specified (typical values 1.1
to 1.2 micron)

Should we have avoided ImSn (as we have done previously)?

Is the spec for the ImSn OK?

Has the PCB mfr done something wrong?

Have we? (apart from accepting ImSn)

Rex


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk


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