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July 2008

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Subject:
From:
Mike Buetow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mike Buetow <[log in to unmask]>
Date:
Tue, 22 Jul 2008 09:22:01 -0400
Content-Type:
text/plain
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text/plain (72 lines)
 Werner, what's that plug for Fantasy Football doing in your signature
line? I thought you were a soccer guy! :-)


Mike Buetow
Editor in Chief
Circuits Assembly
w/m 617-327-4702
 
Virtual-PCB -- the industry's first virtual trade show:
www.virtual-pcb.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, July 22, 2008 9:13 AM
To: [log in to unmask]
Subject: Re: [TN] They solder well... But they don't work!

Hi Dale,
In all your descriptions, you are not telling us what the failure mode
actually is. On the basis of what do 75% not pass? Are the failures just
some undefined functional dysfuction?-your wire-bond inclusion in the
discussion leads me to believe this.
You also are not telling us what the reflow profiles [both standard and
increased] at the QFP leads [not the PCB soldering pads] are. This is
needed to make sure that the heat sink, which the die is and to which
the leads are attached, does not keep the lead temperature too low even
with your increased profile.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg,
Germany Pb-Free Soldering Processes-Survival, Quality, Reliability,
August 18, Orlando Reliability Issues with Lead-Free Soldering
Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses
Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder
Joint Reliability: Parts 1 & 4, Oct. 17, Timisoara, Rumania Solder Joint
Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



**************
Get fantasy football with free live scoring. Sign up for FanHouse
Fantasy Football today.
      
(http://www.fanhouse.com/fantasyaffair?ncid=aolspr00050000000020)

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