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July 2008

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Tue, 22 Jul 2008 06:25:44 -0400
Content-Type:
text/plain
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text/plain (82 lines)
Regards,
 
George
George M. Wenge
Amen 





Regards,

 

George

George M. Wenger

Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 (office) (732) 309-8964 (cell)

[log in to unmask]

 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Tuesday, July 22, 2008 6:22 AM

To: [log in to unmask]

Subject: Re: [TN] looking for ENiG photos



Hi,

I fully agre with Ingemar-that is why I cannot recommend ENIG to my

clients. 

I have seen problems with little P, 'normal' P and excessive P

concentrations- the latter being the worst.



Werner Engelmaier

Future workshops:

Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg,

Germany Pb-Free Soldering Processes-Survival, Quality, Reliability,

August 18, Orlando Reliability Issues with Lead-Free Soldering

Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses

Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg

Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder

Joint Reliability: Parts 1 & 4, Oct. 17, Timisoara, Rumania Solder Joint

Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia







**************

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