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July 2008

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Subject:
From:
Grant Emandien <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Grant Emandien <[log in to unmask]>
Date:
Wed, 2 Jul 2008 11:19:34 +0200
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text/plain
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Hi all,
 
We are experiencing poor solderability with AgPd-terminations on MOVs
exposed to a lead-free reflow profile using a SAC alloy on an
ENIG-finished PCB. Though we have run this board only once previously
with the same part finish using a lead-rich alloy, we had similar
effects but not to the extent we are now experiencing.
 
Can anyone provide some insight into this/
 
Regards
Grant
 

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