Solderable surface + solder & Flux + proper TTP (time temperature profile) =
good solder connection. 

I would evaluate this the same way you do an MLF or LGA. If the process
results look good on the rest of the board and you know the BOT part is
solderable you are golden. X-ray for voids as a verification as you would a
BGA or a D-PAK.  


 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, July 15, 2008 8:20 AM
To: [log in to unmask]
Subject: [TN] Inspection of bottom only terminations / process verification

Hello Netters.

 

Looking for some advice on how to handle a new bottom only termination
device we have.  We don't normally run devices with bottom only
terminations, so the inspection has not been an issue, until now.  Any
recommendations on how to inspect these, or verify the process is working?
I am thinking I might process some samples and send them to a lab for
x-sections (we do not have x-section capability here).  Is that sufficient?

 

Thanks in advance!

 

 

Kevin Glidden

Manufacturing Engineer

Luminescent Systems Inc.


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