The PCB for lead free soldering with the Immersion tin technology has allegedly around 1% of Ag in this Tin plating to alleviate the whickers growth potential.
Would anybody know and tell us if this 1% of Ag is the correct proportion for prevention of the whiskers growth and if not what is the recommendation?
Thank you for info beforehand.
Vit Sklenar .
Robert Bosch (Australia) Pty.Ltd
RBAU-AE/MFE3
Locked Bag 66;Clayton South, VIC 3169
AUSTRALIA
Tel: +61 3 9541-7734
Fax: +61 3 9541-3909
Mob: +61 434 079 373 [log in to unmask]
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