Hi Paul

 

Can you elaborate? What is failing and why? What is then the failure rate  

for lead-free?  The same? Lower? Higher? ... I guess I should read the  papers 

;-) 

 

I am interested in getting copies if you have a spare set... :-)  

 

Maybe Steve would be so kind as to consent to post them to save you a lot  of 

bother should many others have similar interest

 

Thanks in advance, 

Joe 

 

 

In a message dated 7/31/2008 6:29:39 A.M. Pacific Daylight Time,  

[log in to unmask] writes:



My sense  is that 30% of the reliability failures, in a tin-lead

application, are due  to PCB failures.









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