IPC Advanced Packaging Webcast Series







Selecting Components for Lead-Free SMT Assembly



August 14 , 2008 - 10:00 am - 11:00 am







This informative, one-hour webcast explores the impact of lead-free components, reviews several component manufacturers' specifications, and examines various compatible laminates and surface finishes for circuit boards.



Assembly Process Guidelines for Wafer Level CSP

August 21, 2008 - 10:00 am - 11:00 am

In this one-hour webcast, participants will get a solid overview of current wafer level and die-size package technologies, plus explore common assembly process options, attachment material variations and manufacturing methodologies detailed in the new IPC-7094 document, Design and Assembly Process Implementation for Flip Chip and Die Size Components.



For more information, please cut and paste http://www.ipc.org/calendar/2008/AdvancedPackagingWebcastSeries0808/AdvandcedPackagin.htm into your browser or contact Michelle Michelotti at +1 847-597-2822 or e-mail at [log in to unmask]<mailto:[log in to unmask]>.







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